Executive Vice President, Samsung Electronics; Visiting Professor, Cornell Tech
Daniel Lee is the Executive Vice President of Samsung Electronics, and Visiting Professor at Cornell Tech. He is formerly the UPS Foundation Chair Professor in the School of Engineering and Applied Science. He received his B.A. summa cum laude in Physics from Harvard University and his Ph.D. in Condensed Matter Physics from the Massachusetts Institute of Technology in 1995. Before coming to Penn, he was a researcher at AT&T and Lucent Bell Laboratories in the Theoretical Physics and Biological Computation departments. He is a Fellow of the IEEE and AAAI and has received the National Science Foundation CAREER award and the University of Pennsylvania Lindback award for distinguished teaching. He was also a fellow of the Hebrew University Institute of Advanced Studies in Jerusalem, an affiliate of the Korea Advanced Institute of Science and Technology, and organized the US-Japan National Academy of Engineering Frontiers of Engineering symposium. As director of the GRASP Laboratory and founding co-director of the CMU-Penn University Transportation Center, his group focuses on understanding general computational principles in biological systems, and on applying that knowledge to build autonomous systems.
Khan, Arbaaz, Clark Zhang, Nikolay Atanasov, Konstantinos Karydis, Vijay Kumar, Daniel D. Lee. 2017. “Memory Augmented Control Networks.” arXiv.
Khan, Arbaaz, Clark Zhang, Nikolay Atanasov, Konstantinos Karydis, Daniel D. Lee, Vijay Kumar. 2017. “End-to-End Navigation in Unknown Environments using Neural Networks.” arXiv.
McGill, Stephen G, Seung‐Joon Yi, Hak Yi, Min Sung Ahn, Sanghyun Cho, Kevin Liu, Daniel Sun, Bhoram Lee, Heejin Jeong, Jinwook Huh, Dennis Hong, and Daniel D Lee. 2017. “Team THOR’s Entry in the DARPA Robotics Challenge Finals 2015.” Journal of Field Robotics 34(4): 775-801.
Huh, Jinwook, Bhoram Lee, and Daniel D Lee. 2017. “Adaptive motion planning with high-dimensional mixture models.” Robotics and Automation (ICRA), 2017 IEEE International Conference.